Product Model

7007268 FOXBORO MKKDS 3 ASY

In Stock
Last updated: 2025/4/20
Phoenix Contact 7007268 FOXBORO MKKDS 3 ASY

Selling Points

  • 1Handles up to 22 A nominal current.
  • 2Ensures secure and durable connections with tension sleeves.
  • 3Maximizes contact force for reduced thermal stress.
  • 4Latching on the side allows for various positions to be combined.
  • 5Meets WEEE/RoHS and IEC 60068-2-82/ JEDEC JESD 201 standards.
Product Details
7007268 FOXBORO MKKDS 3 ASY
Phoenix Contact

Technical Specifications

Detailed engineering parameters based on manufacturer documentation

ParameterValueParameterValue
Product type
Printed circuit board terminal
Product family
MKKDS 3
Product line
COMBICON Terminals M
Number of rows
2
Solder pins per potential
1
Article revision
01
Nominal current I
22 A
Nominal voltage U
400 V
Rated voltage (III/3)
250 V
Rated surge voltage (III/3)
4 kV
Rated voltage (III/2)
400 V
Rated surge voltage (III/2)
4 kV
Rated voltage (II/2)
630 V
Rated surge voltage (II/2)
4 kV
Type
PC terminal block can be aligned
Nominal cross section
2.5 mm²
Connection method
Screw connection with tension sleeve
Conductor cross section rigid
0.2 mm² ... 4 mm²
Conductor cross section flexible
0.2 mm² ... 2.5 mm²
Conductor cross section AWG
24 ... 12
Conductor cross section flexible, with ferrule without plastic sleeve
0.25 mm² ... 1.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve
0.25 mm² ... 2.5 mm²
2 conductors with same cross section, solid
0.2 mm² ... 1.5 mm²
2 conductors with same cross section, flexible
0.2 mm² ... 1.5 mm²
2 conductors with same cross section, flexible, with ferrule without plastic sleeve
0.25 mm² ... 0.75 mm²
2 conductors with the same cross section, flexible, with TWIN ferrule with plastic sleeve
0.5 mm² ... 0.5 mm²
Stripping length
7 mm
Tightening torque
0.5 Nm ... 0.6 Nm
Mounting type
Wave soldering
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
Tin-plated
Metal surface terminal point (top layer)
Tin (4 - 8 µm Sn)
Metal surface soldering area (top layer)
Tin (4 - 8 µm Sn)
Color ()
()
Insulating material
PA
Insulating material group
I
CTI according to IEC 60112
600
Flammability rating according to UL 94
V0
Glow wire flammability index GWFI according to EN 60695-2-12
850
Glow wire ignition temperature GWIT according to EN 60695-2-13
775
Temperature for the ball pressure test according to EN 60695-10-2
125 °C
Pin dimensions
0.9 x 0.9 mm
Specification
IEC 60998-2-1:2002-12
Result
Test passed
Specification
IEC 60998-2-1:2002-12
Conductor cross section/conductor type/tractive force setpoint/actual value
0.2 mm² / solid / > 10 N 0.2 mm² / flexible / > 10 N 4 mm² / solid / > 60 N 2.5 mm² / flexible / > 50 N
Specification
IEC 60998-2-1:2002-12
Specification
IEC 60998-1:2002-12
Requirement temperature-rise test
Increase in temperature ≤ 45 K
Specification
IEC 60998-1:2002-12
Insulation resistance, neighboring positions
> 80 GΩ
Specification
IEC 60664-1:2007-04
Insulating material group
I
Comparative tracking index (IEC 60112)
CTI 600
Rated insulation voltage (III/3)
250 V
Rated surge voltage (III/3)
4 kV
minimum clearance value - non-homogenous field (III/3)
3 mm
minimum creepage distance (III/3)
3.2 mm
Rated insulation voltage (III/2)
400 V
Rated surge voltage (III/2)
4 kV
minimum clearance value - non-homogenous field (III/2)
3 mm
minimum creepage distance (III/2)
3 mm
Rated insulation voltage (II/2)
630 V
Rated surge voltage (II/2)
4 kV
minimum clearance value - non-homogenous field (II/2)
3 mm
minimum creepage distance (II/2)
3.2 mm
Specification
IEC 60068-2-6:2007-12
Frequency
10 - 150 - 10 Hz
Sweep speed
1 octave/min
Amplitude
0.35 mm (10 Hz ... 60.1 Hz)
Acceleration
5g (60.1 Hz ... 150 Hz)
Test duration per axis
2.5 h
Test directions
X-, Y- and Z-axis
Specification
IEC 60998-1:2002-12
Temperature
850 °C
Time of exposure
5 s
Ambient temperature (operation)
-40 °C ... 100 °C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport)
-40 °C ... 70 °C
Relative humidity (storage/transport)
30 % ... 70 %
Ambient temperature (assembly)
-5 °C ... 100 °C

Specifications may be subject to change without notice