Product Model

MKKDS 1/16-3,5

In Stock
Last updated: 2025/4/17
Phoenix Contact MKKDS 1/16-3,5

Selling Points

  • 1High packing density for efficient connections.
  • 2Rated for 200V nominal voltage and 8A nominal current.
  • 3Double-level design with offset levels for easy access.
  • 4Meets EN-VDE standards for reliable connections.
  • 5Available in packs of 50 for convenient bulk ordering.
Product Details
MKKDS 1/16-3,5
Phoenix Contact

Technical Specifications

Detailed engineering parameters based on manufacturer documentation

ParameterValueParameterValue
Product type
Printed circuit board terminal
Product family
MKKDS 1
Product line
COMBICON Terminals S
Type
PC termination block
Number of positions
16
Pitch
3.5 mm
Number of connections
32
Number of rows
2
Number of potentials
32
Pin layout
Linear pinning
Solder pins per potential
1
Article revision
05
Nominal current I
8 A
Nominal voltage U
200 V
Rated voltage (III/3)
160 V
Rated surge voltage (III/3)
2.5 kV
Rated voltage (III/2)
200 V
Rated surge voltage (III/2)
2.5 kV
Rated voltage (II/2)
400 V
Rated surge voltage (II/2)
2.5 kV
Type
PC termination block
Nominal cross section
1 mm²
Connection method
Screw connection with tension sleeve
Conductor cross section rigid
0.14 mm² ... 1.5 mm²
Conductor cross section flexible
0.14 mm² ... 1 mm²
Conductor cross section AWG
26 ... 16
Conductor cross section flexible, with ferrule without plastic sleeve
0.25 mm² ... 0.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve
0.25 mm² ... 0.5 mm²
2 conductors with same cross section, solid
0.14 mm² ... 0.5 mm²
2 conductors with same cross section, flexible
0.14 mm² ... 0.2 mm²
Stripping length
5 mm
Drive form screw head
Slotted (L)
Tightening torque
0.22 Nm ... 0.25 Nm
Mounting type
Wave soldering
Pin layout
Linear pinning
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
Tin-plated
Metal surface terminal point (top layer)
Tin (5 - 7 µm Sn)
Metal surface terminal point (middle layer)
Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer)
Tin (5 - 7 µm Sn)
Metal surface soldering area (middle layer)
Nickel (2 - 3 µm Ni)
Color (Housing)
green (6021)
Insulating material
PA
Insulating material group
I
CTI according to IEC 60112
600
Flammability rating according to UL 94
V0
Glow wire flammability index GWFI according to EN 60695-2-12
850
Glow wire ignition temperature GWIT according to EN 60695-2-13
775
Temperature for the ball pressure test according to EN 60695-10-2
125 °C
Pitch
3.5 mm
Width [w]
58.25 mm
Height [h]
19.7 mm
Length [l]
16.3 mm
Installed height
16.2 mm
Solder pin length [P]
3.5 mm
Pin dimensions
0.5 x 0.9 mm
Pin spacing
11.4 mm
Hole diameter
1.1 mm
Specification
IEC 60999-1:1999-11
Result
Test passed
Specification
IEC 60999-1:1999-11
Conductor cross section/conductor type/tractive force setpoint/actual value
0.14 mm² / solid / > 10 N 0.14 mm² / flexible / > 10 N 1.5 mm² / solid / > 40 N 1 mm² / flexible / > 35 N
Specification
IEC 60947-7-4:2019-01
Requirement temperature-rise test
The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature.
Specification
IEC 60947-7-4:2019-01
Specification
IEC 60512-3-1:2002-02
Insulation resistance, neighboring positions
> 5 MΩ
Specification
IEC 60947-1:2007-06 + A1:2010-12 + A2:2014-09
Insulating material group
I
Comparative tracking index (IEC 60112)
CTI 600
Rated insulation voltage (III/3)
160 V
Rated surge voltage (III/3)
2.5 kV
minimum clearance value - non-homogenous field (III/3)
1.5 mm
minimum creepage distance (III/3)
2 mm
Note on connection cross section
With connected conductor 1.5 mm² (solid).
Rated insulation voltage (III/2)
200 V
Rated surge voltage (III/2)
2.5 kV
minimum clearance value - non-homogenous field (III/2)
1.5 mm
minimum creepage distance (III/2)
1.5 mm
Rated insulation voltage (II/2)
400 V
Rated surge voltage (II/2)
2.5 kV
minimum clearance value - non-homogenous field (II/2)
1.5 mm
minimum creepage distance (II/2)
2 mm
Specification
IEC 60068-2-6:2007-12
Frequency
10 - 150 - 10 Hz
Sweep speed
1 octave/min
Amplitude
0.35 mm (10 Hz ... 60.1 Hz)
Acceleration
5g (60.1 Hz ... 150 Hz)
Test duration per axis
2.5 h
Test directions
X-, Y- and Z-axis
Specification
IEC 60695-2-10:2013-04
Temperature
850 °C
Time of exposure
5 s
Specification
IEC 60947-7-4:2019-01
Ambient temperature (operation)
-40 °C ... 105 °C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport)
-40 °C ... 70 °C
Relative humidity (storage/transport)
30 % ... 70 %
Ambient temperature (assembly)
-5 °C ... 100 °C
Type of packaging
packed in cardboard

Specifications may be subject to change without notice