schneider TSXFPACC3

Selling Points

  • 1Connects multiple Fipio modules within the Modicon system using an insulated bus.
  • 2Saves space in control cabinets with its compact design.
  • 3Provides physical connection and electrical isolation between Fipio modules.
  • 4Ensures reliable signal transmission with electrical insulation.
  • 5Used for analog and digital I/O expansion, communication modules, and specific function modules like pulse counting and temperature measurement.
Product Details
TSXFPACC3
schneider

Technical Specifications

Detailed engineering parameters based on manufacturer documentation

ParameterValueParameterValue
Range of Product
Modicon Premium Automation platform
Accessory / separate part designation
Insulated bus connection box
accessory / separate part type
Connection box
accessory / separate part category
Connection accessories
Product Specific Application
For trunk cable tap link<br />For connecting 24 V power supply of dust and damp proof TBX modules
Electrical connection
1 connector SUB-D 9
Enclosure Material
Polycarbonate
Net Weight
0.20 lb(US) (0.09 kg)
IP Degree of Protection
IP20

Specifications may be subject to change without notice