Product Model

ZP2-T08UGSS6

In Stock
Last updated: 2025/4/20
SMC ZP2-T08UGSS6

Selling Points

  • 1Vertical vacuum inlet for efficient suction and easy integration.
  • 28mm flat pad diameter ensures precise and stable handling of small components.
  • 3Conductive silicone rubber pad material prevents static buildup, ideal for sensitive electronics.
  • 4Ball spline buffer specification provides smooth and reliable operation.
  • 56mm buffer stroke enhances flexibility and adaptability in various applications.
Product Details
ZP2-T08UGSS6
SMC

Technical Specifications

Detailed engineering parameters based on manufacturer documentation

ParameterValueParameterValue
Buffer Stroke (mm)
6 mm
Buffer Specification
Ball Spline
Pad Material
Conductive Silicone Rubber
Pad Type
Flat Type
Pad Diameter
Φ8 mm
Vacuum Inlet
Vertical

Specifications may be subject to change without notice